Filtering by: events

Social Design Exhibition by Red Dot Design Museum
Jul
13
to Sep 21

Social Design Exhibition by Red Dot Design Museum

  • Chengdu Tianfu Design Industrial Park (map)
  • Google Calendar ICS

We are excited to announce that Mimica is showcased at the Red Dot Design Museum’s Social Design Exhibition in Chengdu, travelling to Red Dot Design Museum in Xiamen next year!

Don’t miss the chance to learn about our Bump  concept at the Chengdu Tianfu Design Industrial Park until Autumn, featured alongside pioneering designs tackling social issues.

View Event →
SWOP - Shanghai World of Packaging
Nov
22
to Nov 24

SWOP - Shanghai World of Packaging

  • Shanghai New International Expo Centre (SNIEC) (map)
  • Google Calendar ICS

Our manufacturing partner, United Caps, will take part in the Shanghai World of Packaging (SWOP) trade show, exhibiting our clever Bump Cap. This is a rare opportunity to interact with our Bump Cap samples, so if you are attending SWOP, head over to the United Caps stand!

View Event →